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COMs, SBCs, Customized, Hypervisor
congatec AG is a leading supplier of industrial computer modules using the standard form factors COM Express, Qseven and SMARC as well as single board computers and customized boards. congatec’s products can be used in a variety of industries and applications, such as industrial automation, medical, transportation, point-of-sale, etc.. Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages.
Our latest news
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25/04/2020
congatec presents ultra-powerful cooling solutions for 3.5-inch SBC
The mass makes the difference
15/04/2020
Virtual 360° congatec Booth
Discover the full spectrum of embedded edge computing, ranging from high-end edge servers to ultra-low-power headless edge-logic systems.
23/03/2020
SGET adopts SMARC 2.1 specification
Advanced connectivity for embedded vision and the edge
25/02/2020
SMARC modules make new 3.5-inch boards scalable
congatec expands 3.5-inch offering to NXP i.MX8 processors
25/02/2020
congatec presents new cooling solutions for 100 Watt edge server ecosystem
Keeping it cool
25/02/2020
MIPI camera support – application-ready and onboard
congatec expands embedded vision portfolio for NXP i.MX 8 processor series
18/02/2020
congatec brings compute power loss-free to the industrial fields
Independent tests confirm the excellent performance of congatec’s 3.5-inch SBC
6/02/2020
From high-end to ultra-low-power edge servers
congatec to focus on embedded edge computing at Embedded World
New products
Products
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conga-IC97
Thin Mini-ITX Board
Thin Mini-ITX Board
- Highest Performance Thin Mini-ITX board
- 5th Gen. Intel® CoreTM Mobile SOC U-Processors
- Ultra Low Power with 15W TDP
- Outstanding Intel® HD Graphics Performance
- Wide Range Power Input 12-24Volt
- congatec embedded Features including embedded Board Controller, Watchdog, GPIOs, ...
- mSATA & mini-PCIe Ports
- 7 years long time availability
- Industrial reliability (24/7 and 0 .. 60°C operation)
- Lifecycle-Management and revision control
- 5th Gen. Intel® CoreTM Mobile SOC U-Processors
- Ultra Low Power with 15W TDP
- Outstanding Intel® HD Graphics Performance
- Wide Range Power Input 12-24Volt
- congatec embedded Features including embedded Board Controller, Watchdog, GPIOs, ...
- mSATA & mini-PCIe Ports
- 7 years long time availability
- Industrial reliability (24/7 and 0 .. 60°C operation)
- Lifecycle-Management and revision control
conga-PA3
High Performance PICO-ITX
High Performance PICO-ITX
- 3rd Gen. Intel® Atom™ / Celeron® processors
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C optional
- Size 72x100 mm
- Pico-ITX Single Board Computer
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C optional
- Size 72x100 mm
- Pico-ITX Single Board Computer
conga-XAF
XTX-Module
XTX-Module
- Low Power XTX Modul
- AMD® Fusion™ processor up to 1.65 GHz
- High Performance Graphics
- AMD® Fusion™ processor up to 1.65 GHz
- High Performance Graphics
conga-TCG
COM Express Type 6 - Error Protected RAM
COM Express Type 6 - Error Protected RAM
- AMD Embedded G-Series SOC APU
- Power saving „Steppe Eagle“ processors
- ECC protected memory up to 8 GByte
- High performance integrated graphics
- Extended longevity, 10+ years
- Power saving „Steppe Eagle“ processors
- ECC protected memory up to 8 GByte
- High performance integrated graphics
- Extended longevity, 10+ years
conga-TCA3
Low Power Consumption COM Express Type6 module
Low Power Consumption COM Express Type6 module
- 3rd Gen. Intel® Atom™ processor up to 4 cores
- COM Express Compact Type 6
- Temperature range up to -40°C .. +85°C
- COM Express Compact Type 6
- Temperature range up to -40°C .. +85°C
conga-TC97
Fast and Compact COM Express Type6 module
Fast and Compact COM Express Type6 module
- 5th Gen. Intel® Core™ i7 dual core processor
- up to Intel® HD Graphics 6000
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension
for improved floating point computing
- COM Express Compact Type 6
- up to Intel® HD Graphics 6000
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension
for improved floating point computing
- COM Express Compact Type 6
conga-MA3
Powerful and Small
Powerful and Small
- 3rd Gen. Intel® Atom™ processor family
- COM Express Mini Type 10
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
- COM Express Mini Type 10
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
conga-MA3E
COM Express Mini Typ10 module with ECC memory
COM Express Mini Typ10 module with ECC memory
- 3rd Gen. Intel® Atom™ processor family
- COM Express Mini Type 10
- ECC protected memory up to 8 GByte
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
- COM Express Mini Type 10
- ECC protected memory up to 8 GByte
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
conga-QG
- AMD Embedded G-Series SOC APU
- ECC protected on module memory up to 8 GByte
- Power saving „Steppe Eagle“ processors
- High performance integrated graphics
- Temperature range up to -40°C .. +85°C
- ECC protected on module memory up to 8 GByte
- Power saving „Steppe Eagle“ processors
- High performance integrated graphics
- Temperature range up to -40°C .. +85°C
conga-QA3
Qseven - High Performance
Qseven - High Performance
- 3rd Gen. Intel® Atom™ processor family
- Low power, up to 4 cores
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
- Low power, up to 4 cores
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
conga-QMX6
ARM Qseven Module
ARM Qseven Module
- Up to Freescale i.MX6 Quad ARM Cortex A9
- Multimedia Performance with HDMI & LVDS
- Camera Interface MIPI CSI-2
- Extended longevity up to 10 years
- Temperature range up to -40°C .. +85°C
- Multimedia Performance with HDMI & LVDS
- Camera Interface MIPI CSI-2
- Extended longevity up to 10 years
- Temperature range up to -40°C .. +85°C
conga-QA4
4k Graphcis Performance Qseven Module
4k Graphcis Performance Qseven Module
- First Intel® Pentium® processor on Qseven
- High performance Intel® Gen. 8 graphics
- Improvement in 4k resolution (3840x2160px)
- 3x independent display support
- Better storage interfaces like SATA3 & USB
- High performance Intel® Gen. 8 graphics
- Improvement in 4k resolution (3840x2160px)
- 3x independent display support
- Better storage interfaces like SATA3 & USB
conga-TCA4
COM Express Typ6
COM Express Typ6
- First Intel® Pentium® Quad Core on COM Express
- High performance Intel® Gen. 8 graphics
- Up to 4k resolution (3840x2160px)
- 3x independent display support
- High performance Intel® Gen. 8 graphics
- Up to 4k resolution (3840x2160px)
- 3x independent display support
conga-TC170
COM Express Typ6
COM Express Typ6
- 6th Generation Intel® Core™ ULV processors
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Up to 32GB dual channel DDR4 memory
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Up to 32GB dual channel DDR4 memory
conga-MA4
COM Express Typ10
COM Express Typ10
- 4th Gen. Intel® Atom™ processor family
- COM Express Mini Type 10 module
- High resolution Intel® Gen. 8 graphics
- COM Express Mini Type 10 module
- High resolution Intel® Gen. 8 graphics
conga-TS170
COM Express Basic
COM Express Basic
- 6th Generation Intel® Core™ processor
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- ECC memory support for Xeon and i3 version
- Up to 32GByte dual channel DDR4 memory
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- ECC memory support for Xeon and i3 version
- Up to 32GByte dual channel DDR4 memory
conga-QA5
Qseven
Qseven
- Intel® Atom™ Quad Core on Qseven
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
- Fast I/Os SATA3, USB 3.0 and PCIe 2.0
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
- Fast I/Os SATA3, USB 3.0 and PCIe 2.0
conga-QA3E
Qseven
Qseven
-Low Power 5 to 10 Watt
-Intel® HD Graphics Generation 7
-ECC memory support
-3rd Generation Intel® Atom™ / Celeron®
-Intel® HD Graphics Generation 7
-ECC memory support
-3rd Generation Intel® Atom™ / Celeron®
conga-QAF
Qseven
Qseven
-Based on AMD Embedded G-Series Processors
-Best price/performance ratio
-High performance graphics
-Best price/performance ratio
-High performance graphics
conga-BAF
COM Express Basic Type 2 Module
COM Express Basic Type 2 Module
- Low Power COM Express Basic Type 2 Module
- AMD® Fusion™ processor up to 1.65 GHz
- High Performance Graphics
- AMD® Fusion™ processor up to 1.65 GHz
- High Performance Graphics
conga-TS175
COM Express Type6
COM Express Type6
- 7th Generation Intel® Core™ processor
-Intel® Xeon® processors for data center applications
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- ECC memory support
- Up to 32 GByte dual channel DDR4 memory
-Intel® Xeon® processors for data center applications
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- ECC memory support
- Up to 32 GByte dual channel DDR4 memory
conga-TS97
COM Express Type6
COM Express Type6
- 5th Gen. Intel® Core™ i7 quad core processor and Intel® Xeon® E3-12xx processors
- Up to Intel® Iris™ Pro Graphics P6300
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension for improved floating point computing
- Up to Intel® Iris™ Pro Graphics P6300
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension for improved floating point computing
conga-TC175
COM Express Type6
COM Express Type6
- 7th Generation Intel® Core™ SOC processor
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- Low power consumption (TDP 15W, cTDP 7.5W)
- Up to 32 GByte dual channel DDR4 memory
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- Low power consumption (TDP 15W, cTDP 7.5W)
- Up to 32 GByte dual channel DDR4 memory
conga-TCA5
COM Express Type6
COM Express Type6
- Intel® Pentium® Quad Core on COM Express
- Enhanced Security Execution
- up to 3 independent Ultra HD displays
- Enhanced Security Execution
- up to 3 independent Ultra HD displays
conga-B7XD
COM Express Type7
COM Express Type7
- Up to Intel® Xeon® D 1577 with 16 Cores
- 2x 10 Gigabit Ethernet KR Interface
- 32x PCI Express lanes
- up to 16 processor cores
- up to 24MByte Cache with Intel Cache Allocation Technology
- industrial grade variants
- 2x 10 Gigabit Ethernet KR Interface
- 32x PCI Express lanes
- up to 16 processor cores
- up to 24MByte Cache with Intel Cache Allocation Technology
- industrial grade variants
conga-MA5
COM Express Type10
COM Express Type10
- 5th Gen. Intel® Atom™ processor family
- COM Express Mini Type 10 module
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
- COM Express Mini Type 10 module
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
conga-XLX
XTX Module
XTX Module
- Low Power XTX Module
- AMD® Geode™ LX800 processor 500MHz
- AMD® Geode™ LX800 processor 500MHz
conga-ELX
ETX Module
ETX Module
- Low Power ETX Module
- AMD® Geode™ LX800 processor 500MHz
- LPC2ISA Bridge
- AMD® Geode™ LX800 processor 500MHz
- LPC2ISA Bridge
conga-ELXeco
ETX Module
ETX Module
- Low Power ETX Module
- AMD® Geode™ LX800 processor 500MHz
- On Board DRAM
- PCI2ISA Bridge
- AMD® Geode™ LX800 processor 500MHz
- On Board DRAM
- PCI2ISA Bridge
conga-IC175
Thin Mini-ITX Single Board Computer
Thin Mini-ITX Single Board Computer
- Highest Performance Thin Mini-ITX board
- 7th Generation Intel® CoreTM Mobile SOC U-Processors
- Improved Graphics Performance with HD600 Series
- Ready for Intel® Optane™ memory technology on M.2
- Wide Range Power Input 12-24 Volt
- 7th Generation Intel® CoreTM Mobile SOC U-Processors
- Improved Graphics Performance with HD600 Series
- Ready for Intel® Optane™ memory technology on M.2
- Wide Range Power Input 12-24 Volt
conga-IC170
Thin Mini-ITX Single Board Computer
Thin Mini-ITX Single Board Computer
- Highest Performance Thin Mini-ITX board
- 6th Generation Intel® CoreTM Mobile SOC U-Processors
- Improved Graphics Performance with HD500 Series
- Wide Range Power Input 12-24 Volt
- congatec embedded Board Controller Features
- 6th Generation Intel® CoreTM Mobile SOC U-Processors
- Improved Graphics Performance with HD500 Series
- Wide Range Power Input 12-24 Volt
- congatec embedded Board Controller Features
conga-IA5
Mini ITX Single Board Computer
Mini ITX Single Board Computer
- Intel® 5th Gen. Atom™, Celeron® and Pentium® Processors
- Low Power CPUs 6 to 12 Watt TDP
- Enhanced Intel® HD Graphics Generation 9
- Long life components for 24/7 embedded use
- Extended Temperature variants
- Low Power CPUs 6 to 12 Watt TDP
- Enhanced Intel® HD Graphics Generation 9
- Long life components for 24/7 embedded use
- Extended Temperature variants
conga-PA5
Pico ITX
Pico ITX
- Intel® 5th Gen. Atom™, Celeron® and Pentium® Processors
- Compact design for size-sensitive devices in harsh environments
- Low Power CPUs 6 to 12 Watt TDP
- Enhanced Intel HD Graphics Generation 9
- Long life components for 24/7 embedded use
- Extended Temperature variants
- Compact design for size-sensitive devices in harsh environments
- Low Power CPUs 6 to 12 Watt TDP
- Enhanced Intel HD Graphics Generation 9
- Long life components for 24/7 embedded use
- Extended Temperature variants
conga-IoT
IoT Gateway
IoT Gateway
- Highly Flexible IoT Gateway
- Based on Intel® Atom™ Architecture
- Application Ready Platform
- Easily Customizable for Rapid Field Deployment
- Flexible and Scalable:
- Computing Performance
- Wireless Connectivity
- Software Integration
- Based on Intel® Atom™ Architecture
- Application Ready Platform
- Easily Customizable for Rapid Field Deployment
- Flexible and Scalable:
- Computing Performance
- Wireless Connectivity
- Software Integration
conga-TC370
COM Express Type 6 Compact module based on 8th Gen
- 8th Generation Intel® Core™ SOC processor
up to 4 cores
- Configuration of display mode by software (LVDS/eDP)
- Low power consumption (TDP 15W, cTDP 10W)
- Up to 64 GByte dual channel DDR4 2400 MT/s
- Optional eMMC 5.1 on board mass storage
- Trusted Platform Module (TPM 2.0)
COM Express Type 6 Compact module based on 8th Gen
- 8th Generation Intel® Core™ SOC processor
up to 4 cores
- Configuration of display mode by software (LVDS/eDP)
- Low power consumption (TDP 15W, cTDP 10W)
- Up to 64 GByte dual channel DDR4 2400 MT/s
- Optional eMMC 5.1 on board mass storage
- Trusted Platform Module (TPM 2.0)
conga-TC87
COM Express Type 6 Compact module based on 4th Gen
- Highest Performance COM Express Type 6
- 4th Generation Intel® Core™ processor family
- Ultra low standby power consumption
COM Express Type 6 Compact module based on 4th Gen
- Highest Performance COM Express Type 6
- 4th Generation Intel® Core™ processor family
- Ultra low standby power consumption
conga-TS370
COM Express Type 6 Basic module based on 8th Gener
- 8th Generation Intel® Core™ processor with up to 6 Cores
- Intel® Xeon® processors for data center applications
- Support for USB 3.1 Gen2 with 10Gbit/s
- Intel® Optane™ memory support
- ECC memory support
- Up to 64 GByte dual channel DDR4 memory
COM Express Type 6 Basic module based on 8th Gener
- 8th Generation Intel® Core™ processor with up to 6 Cores
- Intel® Xeon® processors for data center applications
- Support for USB 3.1 Gen2 with 10Gbit/s
- Intel® Optane™ memory support
- ECC memory support
- Up to 64 GByte dual channel DDR4 memory
conga-TR4
COM Express® Type 6 module based on AMD Ryzen Embe
COM Express® Type 6 module based on AMD Ryzen Embe
-AMD’s Next Gen V1000 processor Series
-“Zen” core architecture with up to 4 cores-Improved graphic performance with “Vega” GPU
-Up to 32GByte dual channel DDR4 3200MT/s memory
-TDP scalable down to 12W -up to 4 x 4K DP / eDP
-“Zen” core architecture with up to 4 cores-Improved graphic performance with “Vega” GPU
-Up to 32GByte dual channel DDR4 3200MT/s memory
-TDP scalable down to 12W -up to 4 x 4K DP / eDP
conga-TR3
COM Express® Type6 module based on AMD Embedded R-
COM Express® Type6 module based on AMD Embedded R-
-AMD Embedded R-Series SOC and G-Series SOC-Up to 4 “Excavator” Cores
-High performance integrated 3rd Gen.GCN graphics with up to 512 stream processors
-Unifi ed Video Decoder (UVD 6) supporting HEVC/H.265 4K@60Hz
-ECC protected DDR4 memory up to 32 GByte-Full HSA 2.0 compliant (Heterogenous System Architecture)
-TDP scalable down to 12W
-High performance integrated 3rd Gen.GCN graphics with up to 512 stream processors
-Unifi ed Video Decoder (UVD 6) supporting HEVC/H.265 4K@60Hz
-ECC protected DDR4 memory up to 32 GByte-Full HSA 2.0 compliant (Heterogenous System Architecture)
-TDP scalable down to 12W
conga-B7E3
COM Express Basic Type 7 Server Class module based
COM Express Basic Type 7 Server Class module based
-COM Express Type 7
-AMD EPYC™ Embedded 3000 Series up to 16 Cores, 32MB Cache and 30..100W TDP
-4x 10 Gigabit Ethernet KR Interface-Up to 32 PCI Express generation 3 lanes
-Industrial grade variant-Optional Onbard NVMe SSD up to 1 TB capacity
-AMD EPYC™ Embedded 3000 Series up to 16 Cores, 32MB Cache and 30..100W TDP
-4x 10 Gigabit Ethernet KR Interface-Up to 32 PCI Express generation 3 lanes
-Industrial grade variant-Optional Onbard NVMe SSD up to 1 TB capacity
conga-B7AC
COM Express Type 7 Basic module based on the lates
COM Express Type 7 Basic module based on the lates
-COM Express Type 7
-Up to Intel® AtomTM C3958 with 16 Cores and 16MB Cache
-4x 10 Gigabit Ethernet KR Interface-Up to 96 Gbyte DDR4 memory
-20 PCI Express lanes
-Industrial grade variants
-Server Class Features (RAS, QoS, Virtualization, Security, Managebility)
-Up to Intel® AtomTM C3958 with 16 Cores and 16MB Cache
-4x 10 Gigabit Ethernet KR Interface-Up to 96 Gbyte DDR4 memory
-20 PCI Express lanes
-Industrial grade variants
-Server Class Features (RAS, QoS, Virtualization, Security, Managebility)
conga-SMX8-Nano
SMARC 2.0 module based on NXP i.MX 8M Nano process
SMARC 2.0 module based on NXP i.MX 8M Nano process
-SMARC 2.0 Module based on NXP i.MX 8M Nano -Provides cost-effective integration for high volume-Up to 4x ARM® Cortex
-A53 + 1x ARM® Cortex-M7-3D GPU with OpenGL ES 3.1
-Pin-compatible and scalable to the i.MX 8M Mini -Extended longevity up to 15 years
-A53 + 1x ARM® Cortex-M7-3D GPU with OpenGL ES 3.1
-Pin-compatible and scalable to the i.MX 8M Mini -Extended longevity up to 15 years
conga-SMX8-Mini
SMARC 2.0 module based on NXP i.MX8M Mini processo
SMARC 2.0 module based on NXP i.MX8M Mini processo
-SMARC 2.0 Module based on NXP i.MX 8M Mini
-Scalable ARM Performance with up to 4x 1.8GHzCortex
-A53 and 1x Cortex-M4F
-Highly improved power efficiency and performanceby 14LPC FinFETprocess technology
-3D Graphics with Full HD resolution-MIPI CSI-2 camera interface-Extended longevity up to 15 years
-Scalable ARM Performance with up to 4x 1.8GHzCortex
-A53 and 1x Cortex-M4F
-Highly improved power efficiency and performanceby 14LPC FinFETprocess technology
-3D Graphics with Full HD resolution-MIPI CSI-2 camera interface-Extended longevity up to 15 years
conga-SMX8X
SMARC 2.0 module based on Ultra Low Power NXP i.MX
SMARC 2.0 module based on Ultra Low Power NXP i.MX
-NXP i.MX8-X ARM Cortex-A35 and Cortex-M4F
-Ultra Low Power 2-5W-Industrial grade, improved Reliability and Virtualization
-3D Graphics up to two independent HD displays-MIPI CSI
-2 camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
-Ultra Low Power 2-5W-Industrial grade, improved Reliability and Virtualization
-3D Graphics up to two independent HD displays-MIPI CSI
-2 camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
conga-SMX8
SMARC 2.0 module based on NXP i.MX8 ARM Cortex-A72
SMARC 2.0 module based on NXP i.MX8 ARM Cortex-A72
-NXP i.MX8 ARM Cortex-A72, Cortex-A53 and Cortex-M4F
-Advanced Graphics, Performance and Virtualization-3D Graphics up to 4K with HDMI 2.0a & LVDS
-Vision Extensions, MIPI CSI
-2 dual camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
-Advanced Graphics, Performance and Virtualization-3D Graphics up to 4K with HDMI 2.0a & LVDS
-Vision Extensions, MIPI CSI
-2 dual camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
conga-SA5
SMARC 2.0 module based on 5th Generation Intel® At
SMARC 2.0 module based on 5th Generation Intel® At
-Low Power Intel® AtomTM, Intel® Celeron® and Intel® Pentium® processor
-High performance Intel® Gen. 9 graphics
-Industrial Temperature-Time Coordinated Computing -Enhanced Security Execution
-High performance Intel® Gen. 9 graphics
-Industrial Temperature-Time Coordinated Computing -Enhanced Security Execution
conga-QMX8X
Ultra Low Power Qseven module based on NXP i.MX8X
Ultra Low Power Qseven module based on NXP i.MX8X
-NXP i.MX8-X ARM Cortex-A35 and Cortex-M4F-Ultra Low Power 2-4W
-Industrial Grade, Improved Reliability and Virtualization
-3D Graphics up to two independent HD displays-MIPI CSI-2 camera interface
-Extended longevity up to 15 years
-Temperature range up to -40°C .. +85°
-Industrial Grade, Improved Reliability and Virtualization
-3D Graphics up to two independent HD displays-MIPI CSI-2 camera interface
-Extended longevity up to 15 years
-Temperature range up to -40°C .. +85°
conga-QMX8
Highest performance Qseven module based on NXP i.M
Highest performance Qseven module based on NXP i.M
-NXP i.MX8 ARM Cortex-A72, Cortex-A53 and -M4F
-Advanced Graphics, Performance and Virtualization
-3D Graphics up to 4K with HDMI 2.0a & LVDS-Vision Extensions, MIPI CSI
-2 dual camera interface-Extended longevity, up to 15 years
-Temperature range up to -40°C .. +85°C
-Advanced Graphics, Performance and Virtualization
-3D Graphics up to 4K with HDMI 2.0a & LVDS-Vision Extensions, MIPI CSI
-2 dual camera interface-Extended longevity, up to 15 years
-Temperature range up to -40°C .. +85°C
conga-EAF
ETX module AMD Fusion G-Series Processors
ETX module AMD Fusion G-Series Processors
-Based on AMD Embedded G-Series Processors
-Best price/performance ratio
-High performance graphics
-Best price/performance ratio
-High performance graphics
conga-IC370
Highest Performance Thin-Mini-ITX board based on 8
Highest Performance Thin-Mini-ITX board based on 8
-Highest Performance Thin Mini-ITX board
-8th Generation Intel® Core™ MobileLow Power U-Processors with up to 4 cores
-Gen 9 Intel Graphics; up to 24EU-Options for 2nd internal display-Wide Range Power Input 12-24 Volt-congatec embedded Board Controller Features
-8th Generation Intel® Core™ MobileLow Power U-Processors with up to 4 cores
-Gen 9 Intel Graphics; up to 24EU-Options for 2nd internal display-Wide Range Power Input 12-24 Volt-congatec embedded Board Controller Features
conga-IT6
COM Express Type 6 Carrier Board on Mini-ITX form
- COM Express Type 6 Carrier Board
- Mini-ITX form factor
COM Express Type 6 Carrier Board on Mini-ITX form
- COM Express Type 6 Carrier Board
- Mini-ITX form factor
conga-JC370
Highest Performance 3.5'' Single Board Computer ba
Highest Performance 3.5'' Single Board Computer ba
-Highest Performance 3.5’’ Single Board Computer-8thGeneration Intel® Core™ SOC processors with up to 4 cores-Intel® UHD
-Graphics 610/620,up to 24 Execution Units
-Up to 64 GByte dual channel DDR4 2400 MT/s
-Multiple Expansion card sockets
-Flexible internal and external Video interfaces
-Wide Range Power Input 12 –24V
-congatec embedded Board Controller Features
-Graphics 610/620,up to 24 Execution Units
-Up to 64 GByte dual channel DDR4 2400 MT/s
-Multiple Expansion card sockets
-Flexible internal and external Video interfaces
-Wide Range Power Input 12 –24V
-congatec embedded Board Controller Features
conga-IoT 2
IoT Gateway Hardware Platform based on Intel "Apol
IoT Gateway Hardware Platform based on Intel "Apol
-Highly Flexible IoT Gateway-Based on Intel® Atom™ Architecture
-Application Ready Platform-Easily Customizable for Rapid Field Deployment
-Highly Configurable Utilizing Standard Wire-less and Cellular add-on cards
-Flexible and Scalable:
-Computing Performance-Wireless Connectivity
-Software Integration
-Application Ready Platform-Easily Customizable for Rapid Field Deployment
-Highly Configurable Utilizing Standard Wire-less and Cellular add-on cards
-Flexible and Scalable:
-Computing Performance-Wireless Connectivity
-Software Integration
conga-SMC1/SMARC-ARM
- Compact sized SMARC 2.0 Carrier Board
- Ready-to-use Carrier Board
- Platform for rapid
- Support of fast implementation and improved Time-To-Market
- Ready-to-use Carrier Board
- Platform for rapid
- Support of fast implementation and improved Time-To-Market
conga-TS87
COM Express® Type6 module based on 4th Generation
COM Express® Type6 module based on 4th Generation
- 4th Generation Intel® Core™ processor-based platform
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension for improved floating point computing
- Up to 13% higher computing performance*
- Up to 32% higher 3D graphics performance*
* Compared to previous generation
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension for improved floating point computing
- Up to 13% higher computing performance*
- Up to 32% higher 3D graphics performance*
* Compared to previous generation
conga-MIPI/Skit-ARM
- Application-ready embedded vision kit to enable video analytics at the industrial IOT Edge
- Using this kit enables instant deployable industrial-grade plug and play camera applications
- Based on 3.5“ Carrier Board conga-SMC1, SMARC 2.0 conga-SMX8 and Basler 13MP MIPI camera
- Using this kit enables instant deployable industrial-grade plug and play camera applications
- Based on 3.5“ Carrier Board conga-SMC1, SMARC 2.0 conga-SMX8 and Basler 13MP MIPI camera
conga-X7EVAL
- Evaluation Carrier Board for COM Express Type 7 modules
- Schematics available
- Schematics available
conga-TEVAL/COMe 2.1
- COM Express Type 6
- Evaluation Carrier Board
- Schematics available
- Reference Carrier Board
- Evaluation Carrier Board
- Schematics available
- Reference Carrier Board
conga-MCB|COM Express
- Mini Carrier Board for COM Express
- Supporting Compact Type 2 Modules
- Complete Set of IOs
- Size 95x145 mm²
- Supporting Compact Type 2 Modules
- Complete Set of IOs
- Size 95x145 mm²
conga-Xdebug
- Debug Tool for XTX
- Plugs between the Carrier Board and XTX Module
- USB, SATA, VGA, Power, ...
- Plugs between the Carrier Board and XTX Module
- USB, SATA, VGA, Power, ...
conga-MEVAL
- COM Express Type 10
- Evaluation Carrier Board
- Schematics available
- Reference Carrier Board
- Evaluation Carrier Board
- Schematics available
- Reference Carrier Board
conga-DP/HDMI 4k Adapter
conga-Q7/MFG-Serial-Adapter
- provides the ability to access the console in/output of conga-QMX6/UMX6
conga-TEVAL/COMe 3.0
- COM Express Type 6 Rev. 3.0 Evaluation Carrier Board
- Reference Carrier Board
- Reference Carrier Board
conga-XDVI
- SDVO to DVI-D
- For XTX Modules
- 2x DVI-D
- For XTX Modules
- 2x DVI-D
conga-CAM-KIT/MIPI
- Application-Ready Bundle to Enable Video Analytics at the Industrial IoT Edge
- Using this Kit Enables Instant Deployable Industrial-Grade Camera Applications
- Based on conga-PA5 Pico-ITX Single-Board-Computer with Intel Celeron N3350 processor
- Using this Kit Enables Instant Deployable Industrial-Grade Camera Applications
- Based on conga-PA5 Pico-ITX Single-Board-Computer with Intel Celeron N3350 processor
conga-STX7/carrier
- Intel® 5x5 mini-STX form factor (5.5“ x 5.8“)
- 4 x 10 GbE LAN (SFP+ modules)
- 3 x 1 GbE LAN
- 3 x M.2 sockets (2x M-Key 2280, 1x B-Key 3042)
- Onboard BMC ASPEED AST2500
- General purpose B2B connector for add-on cards (PCIe x16)
- 4 x 10 GbE LAN (SFP+ modules)
- 3 x 1 GbE LAN
- 3 x M.2 sockets (2x M-Key 2280, 1x B-Key 3042)
- Onboard BMC ASPEED AST2500
- General purpose B2B connector for add-on cards (PCIe x16)
conga-SKIT/APL
- SMARC 2.0 Starter Kit
- All accessories out of the box
- Immediate evaluation for SMARC 2.0
- All accessories out of the box
- Immediate evaluation for SMARC 2.0
conga-MCB|Qseven
- Mini Carrier Board for Qseven
- Complete Set of IOs
- Size 95x140 mm²
- Complete Set of IOs
- Size 95x140 mm²
conga-CEVAL
- COM Express Type 2
- Evaluation Carrier Board
- Schematics available
- Reference Carrier Board
- Evaluation Carrier Board
- Schematics available
- Reference Carrier Board
conga-LDVI
- Converts LVDS to DVI-D
- Small Size
- Allows for Dual DVI-D Systems
- Small Size
- Allows for Dual DVI-D Systems
conga-SEVAL
- SMARC 2.0 Evaluation Carrier Board
- Reference Carrier Board
- Reference Carrier Board
conga-SKIT/ARM i.MX8
- Starter Kit for SMARC 2.0 Development
- All accessories out of the box
- Immediate evaluation for SMARC 2.0
- All accessories out of the box
- Immediate evaluation for SMARC 2.0
conga-QKIT/ARM
- Qseven Starter Kit for ARM
- All accessories out of the box
- Immediate evaluation for Qseven
- All accessories out of the box
- Immediate evaluation for Qseven
conga-QKIT/x86
- Qseven Starter Kit
- All accessories out of the box
- Immediate evaluation for Qseven
- All accessories out of the box
- Immediate evaluation for Qseven
conga-Cdebug
- Debug Tool for COM Express Type 2
- Plugs between the Carrier Board and the CPU Module
- Enhanced Debug Features
- Plugs between the Carrier Board and the CPU Module
- Enhanced Debug Features
conga-MCB/Qseven-ARM
- Mini Carrier Board for Qseven ARM
- Complete Set of IOs
- Dimension: 145 x 95mm
- Complete Set of IOs
- Dimension: 145 x 95mm
conga-QEVAL/Qseven 2.0
- Qseven Evaluation Carrier Board for Qseven 2.0
- Reference Carrier Board
- Reference Carrier Board
Downloads
congatec Product Guide
Video
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Embedded World 2020
Embedded World 2020
conga-TC370 - COM Express Compact Module
World-leading platforms for embedded system
8th Gen Intel® Core™ U-Series processors
congatec's first COM Express Type 7 module
The 3.5 inch single board computer (SBC) business
Retail Deep Learning Application
Embedded world 2019
Photo
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