Computer-on-Modules, Real-Time Hypervisor
congatec is a growing technology company focusing on embedded computing products. The high-performance computer modules are used in a wide range of applications and devices.
Real-Time Systems GmbH is a Market leader for hypervisor technology for the General Embedded Market and Experts in real-time virtualization. With an extensive knowledge of quality software design, Real-Time Systems provides a competitive advantage to their customers. Find more information at www.real-time-systems.com
Real-Time Systems GmbH is a Market leader for hypervisor technology for the General Embedded Market and Experts in real-time virtualization. With an extensive knowledge of quality software design, Real-Time Systems provides a competitive advantage to their customers. Find more information at www.real-time-systems.com
New products
Products
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conga-TCA3
Low Power Consumption COM Express Type6 module
Low Power Consumption COM Express Type6 module
- 3rd Gen. Intel® Atom™ processor up to 4 cores
- COM Express Compact Type 6
- Temperature range up to -40°C .. +85°C
- COM Express Compact Type 6
- Temperature range up to -40°C .. +85°C
conga-TC97
Fast and Compact COM Express Type6 module
Fast and Compact COM Express Type6 module
- 5th Gen. Intel® Core™ i7 dual core processor
- up to Intel® HD Graphics 6000
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension
for improved floating point computing
- COM Express Compact Type 6
- up to Intel® HD Graphics 6000
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension
for improved floating point computing
- COM Express Compact Type 6
conga-MA3
Powerful and Small
Powerful and Small
- 3rd Gen. Intel® Atom™ processor family
- COM Express Mini Type 10
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
- COM Express Mini Type 10
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
conga-TC170
COM Express Typ6
COM Express Typ6
- 6th Generation Intel® Core™ ULV processors
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Up to 32GB dual channel DDR4 memory
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Up to 32GB dual channel DDR4 memory
conga-TS170
COM Express Basic
COM Express Basic
- 6th Generation Intel® Core™ processor
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- ECC memory support for Xeon and i3 version
- Up to 32GByte dual channel DDR4 memory
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- ECC memory support for Xeon and i3 version
- Up to 32GByte dual channel DDR4 memory
conga-QA5
Qseven
Qseven
- Intel® Atom™ Quad Core on Qseven
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
- Fast I/Os SATA3, USB 3.0 and PCIe 2.0
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
- Fast I/Os SATA3, USB 3.0 and PCIe 2.0
conga-TS175
COM Express Type6
COM Express Type6
- 7th Generation Intel® Core™ processor
-Intel® Xeon® processors for data center applications
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- ECC memory support
- Up to 32 GByte dual channel DDR4 memory
-Intel® Xeon® processors for data center applications
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- ECC memory support
- Up to 32 GByte dual channel DDR4 memory
conga-TC175
COM Express Type6
COM Express Type6
- 7th Generation Intel® Core™ SOC processor
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- Low power consumption (TDP 15W, cTDP 7.5W)
- Up to 32 GByte dual channel DDR4 memory
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- Low power consumption (TDP 15W, cTDP 7.5W)
- Up to 32 GByte dual channel DDR4 memory
conga-TCA5
COM Express Type6
COM Express Type6
- Intel® Pentium® Quad Core on COM Express
- Enhanced Security Execution
- up to 3 independent Ultra HD displays
- Enhanced Security Execution
- up to 3 independent Ultra HD displays
conga-B7XD
COM Express Type7
COM Express Type7
- Up to Intel® Xeon® D 1577 with 16 Cores
- 2x 10 Gigabit Ethernet KR Interface
- 32x PCI Express lanes
- up to 16 processor cores
- up to 24MByte Cache with Intel Cache Allocation Technology
- industrial grade variants
- 2x 10 Gigabit Ethernet KR Interface
- 32x PCI Express lanes
- up to 16 processor cores
- up to 24MByte Cache with Intel Cache Allocation Technology
- industrial grade variants
conga-MA5
COM Express Type10
COM Express Type10
- 5th Gen. Intel® Atom™ processor family
- COM Express Mini Type 10 module
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
- COM Express Mini Type 10 module
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
conga-PA5
Pico ITX
Pico ITX
- Intel® 5th Gen. Atom™, Celeron® and Pentium® Processors
- Compact design for size-sensitive devices in harsh environments
- Low Power CPUs 6 to 12 Watt TDP
- Enhanced Intel HD Graphics Generation 9
- Long life components for 24/7 embedded use
- Extended Temperature variants
- Compact design for size-sensitive devices in harsh environments
- Low Power CPUs 6 to 12 Watt TDP
- Enhanced Intel HD Graphics Generation 9
- Long life components for 24/7 embedded use
- Extended Temperature variants
conga-TC370
COM Express Type 6 Compact module based on 8th Gen
- 8th Generation Intel® Core™ SOC processor
up to 4 cores
- Configuration of display mode by software (LVDS/eDP)
- Low power consumption (TDP 15W, cTDP 10W)
- Up to 64 GByte dual channel DDR4 2400 MT/s
- Optional eMMC 5.1 on board mass storage
- Trusted Platform Module (TPM 2.0)
COM Express Type 6 Compact module based on 8th Gen
- 8th Generation Intel® Core™ SOC processor
up to 4 cores
- Configuration of display mode by software (LVDS/eDP)
- Low power consumption (TDP 15W, cTDP 10W)
- Up to 64 GByte dual channel DDR4 2400 MT/s
- Optional eMMC 5.1 on board mass storage
- Trusted Platform Module (TPM 2.0)
conga-TS370
COM Express Type 6 Basic module based on 8th Gener
- 8th Generation Intel® Core™ processor with up to 6 Cores
- Intel® Xeon® processors for data center applications
- Support for USB 3.1 Gen2 with 10Gbit/s
- Intel® Optane™ memory support
- ECC memory support
- Up to 64 GByte dual channel DDR4 memory
COM Express Type 6 Basic module based on 8th Gener
- 8th Generation Intel® Core™ processor with up to 6 Cores
- Intel® Xeon® processors for data center applications
- Support for USB 3.1 Gen2 with 10Gbit/s
- Intel® Optane™ memory support
- ECC memory support
- Up to 64 GByte dual channel DDR4 memory
conga-TR4
COM Express® Type 6 module based on AMD Ryzen Embe
COM Express® Type 6 module based on AMD Ryzen Embe
-AMD’s Next Gen V1000 processor Series
-“Zen” core architecture with up to 4 cores-Improved graphic performance with “Vega” GPU
-Up to 32GByte dual channel DDR4 3200MT/s memory
-TDP scalable down to 12W -up to 4 x 4K DP / eDP
-“Zen” core architecture with up to 4 cores-Improved graphic performance with “Vega” GPU
-Up to 32GByte dual channel DDR4 3200MT/s memory
-TDP scalable down to 12W -up to 4 x 4K DP / eDP
conga-B7E3
COM Express Basic Type 7 Server Class module based
COM Express Basic Type 7 Server Class module based
-COM Express Type 7
-AMD EPYC™ Embedded 3000 Series up to 16 Cores, 32MB Cache and 30..100W TDP
-4x 10 Gigabit Ethernet KR Interface-Up to 32 PCI Express generation 3 lanes
-Industrial grade variant-Optional Onbard NVMe SSD up to 1 TB capacity
-AMD EPYC™ Embedded 3000 Series up to 16 Cores, 32MB Cache and 30..100W TDP
-4x 10 Gigabit Ethernet KR Interface-Up to 32 PCI Express generation 3 lanes
-Industrial grade variant-Optional Onbard NVMe SSD up to 1 TB capacity
conga-B7AC
COM Express Type 7 Basic module based on the lates
COM Express Type 7 Basic module based on the lates
-COM Express Type 7
-Up to Intel® AtomTM C3958 with 16 Cores and 16MB Cache
-4x 10 Gigabit Ethernet KR Interface-Up to 96 Gbyte DDR4 memory
-20 PCI Express lanes
-Industrial grade variants
-Server Class Features (RAS, QoS, Virtualization, Security, Managebility)
-Up to Intel® AtomTM C3958 with 16 Cores and 16MB Cache
-4x 10 Gigabit Ethernet KR Interface-Up to 96 Gbyte DDR4 memory
-20 PCI Express lanes
-Industrial grade variants
-Server Class Features (RAS, QoS, Virtualization, Security, Managebility)
conga-SMX8-Mini
SMARC 2.0 module based on NXP i.MX8M Mini processo
SMARC 2.0 module based on NXP i.MX8M Mini processo
-SMARC 2.0 Module based on NXP i.MX 8M Mini
-Scalable ARM Performance with up to 4x 1.8GHzCortex
-A53 and 1x Cortex-M4F
-Highly improved power efficiency and performanceby 14LPC FinFETprocess technology
-3D Graphics with Full HD resolution-MIPI CSI-2 camera interface-Extended longevity up to 15 years
-Scalable ARM Performance with up to 4x 1.8GHzCortex
-A53 and 1x Cortex-M4F
-Highly improved power efficiency and performanceby 14LPC FinFETprocess technology
-3D Graphics with Full HD resolution-MIPI CSI-2 camera interface-Extended longevity up to 15 years
conga-SMX8X
SMARC 2.0 module based on Ultra Low Power NXP i.MX
SMARC 2.0 module based on Ultra Low Power NXP i.MX
-NXP i.MX8-X ARM Cortex-A35 and Cortex-M4F
-Ultra Low Power 2-5W-Industrial grade, improved Reliability and Virtualization
-3D Graphics up to two independent HD displays-MIPI CSI
-2 camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
-Ultra Low Power 2-5W-Industrial grade, improved Reliability and Virtualization
-3D Graphics up to two independent HD displays-MIPI CSI
-2 camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
conga-SMX8
SMARC 2.0 module based on NXP i.MX8 ARM Cortex-A72
SMARC 2.0 module based on NXP i.MX8 ARM Cortex-A72
-NXP i.MX8 ARM Cortex-A72, Cortex-A53 and Cortex-M4F
-Advanced Graphics, Performance and Virtualization-3D Graphics up to 4K with HDMI 2.0a & LVDS
-Vision Extensions, MIPI CSI
-2 dual camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
-Advanced Graphics, Performance and Virtualization-3D Graphics up to 4K with HDMI 2.0a & LVDS
-Vision Extensions, MIPI CSI
-2 dual camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
conga-SA5
SMARC 2.0 module based on 5th Generation Intel® At
SMARC 2.0 module based on 5th Generation Intel® At
-Low Power Intel® AtomTM, Intel® Celeron® and Intel® Pentium® processor
-High performance Intel® Gen. 9 graphics
-Industrial Temperature-Time Coordinated Computing -Enhanced Security Execution
-High performance Intel® Gen. 9 graphics
-Industrial Temperature-Time Coordinated Computing -Enhanced Security Execution
conga-JC370
Highest Performance 3.5'' Single Board Computer ba
Highest Performance 3.5'' Single Board Computer ba
-Highest Performance 3.5’’ Single Board Computer-8thGeneration Intel® Core™ SOC processors with up to 4 cores-Intel® UHD
-Graphics 610/620,up to 24 Execution Units
-Up to 64 GByte dual channel DDR4 2400 MT/s
-Multiple Expansion card sockets
-Flexible internal and external Video interfaces
-Wide Range Power Input 12 –24V
-congatec embedded Board Controller Features
-Graphics 610/620,up to 24 Execution Units
-Up to 64 GByte dual channel DDR4 2400 MT/s
-Multiple Expansion card sockets
-Flexible internal and external Video interfaces
-Wide Range Power Input 12 –24V
-congatec embedded Board Controller Features
conga-SMC1/SMARC-ARM
- Compact sized SMARC 2.0 Carrier Board
- Ready-to-use Carrier Board
- Platform for rapid
- Support of fast implementation and improved Time-To-Market
- Ready-to-use Carrier Board
- Platform for rapid
- Support of fast implementation and improved Time-To-Market
conga-MEVAL
- COM Express Type 10
- Evaluation Carrier Board
- Schematics available
- Reference Carrier Board
- Evaluation Carrier Board
- Schematics available
- Reference Carrier Board
conga-STX7/carrier
- Intel® 5x5 mini-STX form factor (5.5“ x 5.8“)
- 4 x 10 GbE LAN (SFP+ modules)
- 3 x 1 GbE LAN
- 3 x M.2 sockets (2x M-Key 2280, 1x B-Key 3042)
- Onboard BMC ASPEED AST2500
- General purpose B2B connector for add-on cards (PCIe x16)
- 4 x 10 GbE LAN (SFP+ modules)
- 3 x 1 GbE LAN
- 3 x M.2 sockets (2x M-Key 2280, 1x B-Key 3042)
- Onboard BMC ASPEED AST2500
- General purpose B2B connector for add-on cards (PCIe x16)
conga-SEVAL
- SMARC 2.0 Evaluation Carrier Board
- Reference Carrier Board
- Reference Carrier Board
conga-QKIT/x86
- Qseven Starter Kit
- All accessories out of the box
- Immediate evaluation for Qseven
- All accessories out of the box
- Immediate evaluation for Qseven
conga-PA7
Pico-ITX SBC based on Intel® Atom® x6000E, Intel®
Pico-ITX SBC based on Intel® Atom® x6000E, Intel®
-High performance Intel® UHD Graphics (Gen11)
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing enable improved Realtime Capability
-Up to 4.267 MT/s Memory Support with Inband ECC
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing enable improved Realtime Capability
-Up to 4.267 MT/s Memory Support with Inband ECC
conga-SA7
SMARC 2.1 module based on Intel® Atom® x6000E and
SMARC 2.1 module based on Intel® Atom® x6000E and
-High performance Intel® UHD Graphics (Gen11)
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s Memory Support with Inband ECC
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s Memory Support with Inband ECC
conga-QA7
Qseven module based on Intel® Atom® x6000E, Intel®
Qseven module based on Intel® Atom® x6000E, Intel®
-High performance Intel® UHD Graphics (Gen11)
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s onboard Memory Support with Inband ECC
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s onboard Memory Support with Inband ECC
conga-MA7
COM Express® Mini Type 10 module based on Intel® A
COM Express® Mini Type 10 module based on Intel® A
-High performance Intel® UHD Graphics (Gen11)
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s onboard Memory Support with Inband ECC
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s onboard Memory Support with Inband ECC
conga-TCA7
COM Express Type 6 Compact based on Intel® Atom® x
COM Express Type 6 Compact based on Intel® Atom® x
-High performance Intel® UHD Graphics (Gen11)
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 3.200 MT/s DDR4 SODIMM Memory Support with Inband ECC
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 3.200 MT/s DDR4 SODIMM Memory Support with Inband ECC
conga-TC570
COM Express Type 6 Compact module based on 11th Ge
COM Express Type 6 Compact module based on 11th Ge
-COM Express Type 6 Compact
-PCI Express Gen 4 ?
-Embedded/Industrial use condition
-Extended temperature options available
-Integrated high performance Xe (Gen 12) graphics with 96 EU
-AI/DL Instruction Sets including VNNI
-PCI Express Gen 4 ?
-Embedded/Industrial use condition
-Extended temperature options available
-Integrated high performance Xe (Gen 12) graphics with 96 EU
-AI/DL Instruction Sets including VNNI
conga-HPC/cTLU
COM-HPC high performance module based on 11th Gen
COM-HPC high performance module based on 11th Gen
-COM HPC Client Size A
-PCI Express Gen 4 ?
-Embedded/Industrial use condition
-Extended temperature options available
-Integrated high performance Xe (Gen 12) graphics with 96 EU
-AI/DL Instruction Sets including VNNI
-PCI Express Gen 4 ?
-Embedded/Industrial use condition
-Extended temperature options available
-Integrated high performance Xe (Gen 12) graphics with 96 EU
-AI/DL Instruction Sets including VNNI
conga-TCV2
COM Express Type 6 Compact module based on AMD Emb
COM Express Type 6 Compact module based on AMD Emb
-COM Express Compact Type 6
-Next gen 7nm SOC
-High performance Zen 2 CPU & VEGA 7 GPU
-Huge scalability with TDP Range from 10-54W
-Up to 64GByte dual channel DDR4 3200MT/s memory ECC & Non ECC
-AMD Secure Processor with Secure Boot (SME)
-Next gen 7nm SOC
-High performance Zen 2 CPU & VEGA 7 GPU
-Huge scalability with TDP Range from 10-54W
-Up to 64GByte dual channel DDR4 3200MT/s memory ECC & Non ECC
-AMD Secure Processor with Secure Boot (SME)
conga-TEVAL/COMe 3.0
Evaluation Carrier Board for COM Express® Type 6 M
Evaluation Carrier Board for COM Express® Type 6 M
-COM Express Type 6 Rev. 3.0 Evaluation Carrier Board
-Reference Carrier Board
-Reference Carrier Board
conga-TS570
COM Express Type 6 Basic module based on 11th Gene
COM Express Type 6 Basic module based on 11th Gene
-Embedded/Industrial use condition
-Extended temperature options available
-PCI Express Gen 4
-AI/DL Instruction Sets including VNNI
-Optional onboard NVMe SSD
-Integrated Xe (Gen 12) graphics with 32 EU
-Extended temperature options available
-PCI Express Gen 4
-AI/DL Instruction Sets including VNNI
-Optional onboard NVMe SSD
-Integrated Xe (Gen 12) graphics with 32 EU
conga-HPC/cTLH
COM-HPC high performance module based on 11th Gen
Embedded/Industrial use condition
-Extended temperature options available
-PCI Express Gen 4 | USB 4.0
-AI/DL Instruction Sets including VNNI
-Up to 128 Gbyte DDR4-3200 MT/s
-Integrated Xe (Gen 12) graphics with 32 EU
COM-HPC high performance module based on 11th Gen
Embedded/Industrial use condition
-Extended temperature options available
-PCI Express Gen 4 | USB 4.0
-AI/DL Instruction Sets including VNNI
-Up to 128 Gbyte DDR4-3200 MT/s
-Integrated Xe (Gen 12) graphics with 32 EU
conga-HPC/cALS
COM-HPC Client Size C module based on 12th Gen Int
COM-HPC Client Size C module based on 12th Gen Int
Intel® hybrid design combines Performance-cores with Efficient–cores
Intel® UHD Graphics 770 driven by Xe Architecture
PCI Express Gen 4/5 | USB 3.2 Gen 2
AI Acceleration based on Intel® Deep Learning
Embedded Use Condition SKUs
Intel® UHD Graphics 770 driven by Xe Architecture
PCI Express Gen 4/5 | USB 3.2 Gen 2
AI Acceleration based on Intel® Deep Learning
Embedded Use Condition SKUs
conga-HPC/cALP
COM-HPC high performance module based on 12th Gen
COM-HPC high performance module based on 12th Gen
Intel® hybrid design combines Performance-cores with Efficient–cores
UP to Intel® Iris® Xe Graphics architecture with up to 96 EUs
PCI Express Gen 4 | USB 4
AI Acceleration with Intel® Deep Learning Boost (VNNI)
Embedded Use Condition SKUs
UP to Intel® Iris® Xe Graphics architecture with up to 96 EUs
PCI Express Gen 4 | USB 4
AI Acceleration with Intel® Deep Learning Boost (VNNI)
Embedded Use Condition SKUs
conga-SMX8-Plus
Smarc 2.1 module based on NXP i.MX 8M Plus 14 nm p
Smarc 2.1 module based on NXP i.MX 8M Plus 14 nm p
-NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU
-Enhanced AI, Machine Learning and Vision capabilities featuring NPU and integrated camera ISP’s
- Ultra low power architecture with 2-6W
- Support for up to 3 independent displays
- Extended longevity up to 15 years
- Temperature range up to -40°C .. +85°C
-Enhanced AI, Machine Learning and Vision capabilities featuring NPU and integrated camera ISP’s
- Ultra low power architecture with 2-6W
- Support for up to 3 independent displays
- Extended longevity up to 15 years
- Temperature range up to -40°C .. +85°C
conga-QMX8-Plus
Qseven module based on NXP i.MX 8M Plus 14nm proce
Qseven module based on NXP i.MX 8M Plus 14nm proce
- NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU
- Enhanced AI, Machine Learning and Vision capabilities featuring NPU and integrated camera ISP’s
- Ultra low power architecture with 2-5W
- Extended longevity up to 15 years
- Temperature range up to -40°C .. +85°C
- Enhanced AI, Machine Learning and Vision capabilities featuring NPU and integrated camera ISP’s
- Ultra low power architecture with 2-5W
- Extended longevity up to 15 years
- Temperature range up to -40°C .. +85°C
conga-HPC/sILH
COM-HPC Server Size E module based on Intel® Xeon®
- Industrial Use Condition with extended Temperature options
- AI Capabilities with Intel® DL boost
- Real Time Capable Platform
- Supporting up to 1 TB DDR4 2933MT/s Memory
COM-HPC Server Size E module based on Intel® Xeon®
- Industrial Use Condition with extended Temperature options
- AI Capabilities with Intel® DL boost
- Real Time Capable Platform
- Supporting up to 1 TB DDR4 2933MT/s Memory
conga-HPC/sILL
COM-HPC Server Size D module based on Intel® Xeon®
- Industrial Use Condition with extended Temperature options
- 32 PCIe Express lanes
- AI Capabilities with Intel® DL boost
- Real Time Capable Platform
- Supporting up to 256 GB DDR4 2933MT/s Memory
COM-HPC Server Size D module based on Intel® Xeon®
- Industrial Use Condition with extended Temperature options
- 32 PCIe Express lanes
- AI Capabilities with Intel® DL boost
- Real Time Capable Platform
- Supporting up to 256 GB DDR4 2933MT/s Memory
Downloads
congatec Product Guide
Video
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Alder Lake | conga technology talk
congatec at the Intertraffic Amsterdam 2022
Low-power AI accelerated embedded applications
New Server-on-Modules based on Intel® Xeon
COM-HPC & COM Express Server-on-Modules
Industrial High Performance COM Express & COM-HPC
simplify the use of embedded technology
New COM-HPC Client size B & COM Express Type 6
onga-TC570r - New ultra-rugged
What are Computer-on-Modules?
How to create and insert an OEM boot logo
conga-SMX8-Plus - SMARC 2.1 modules
How to mount congatec cooling solutions
congatec starter set for COM-HPC™
COM Express & COM-HPC | Interview
COM-HPC Client Size C module
COM-HPC & COM Express Computer-on-Modules
Real-Time Systems - Hypervisor from your Expert of
Real-Time Workload Consolidation
Real-Time Systems and Intel® Real-Time
Best usage of hardware ressources
Qseven with NXP i.MX8
congatec at a glance
What are Computer-on-Modules
Ultra-rugged Computer-on-Module
congatec's technical services
COM-HPC & COM Express Computer-on-Modules
COM-HPC Client Size C module
COM-HPS Starter Set
Embedded Computer-on-Modules
Interview: Intel Atom® x6000E processor
Interview: 11th Gen Intel® Core™ processors
conga-TC570
conga-PA5
conga-TC370 - COM Express Compact Module
World-leading platforms for embedded system
8th Gen Intel® Core™ U-Series processors
congatec's first COM Express Type 7 module
Retail Deep Learning Application
Photo
Multimedia
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