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COMs, SBCs, Customized, Hypervisor, COM HPC
congatec GmbH is a leading supplier of industrial computer modules using the standard form factors COM Express, Qseven and SMARC as well as single board computers and customized boards. congatec’s products can be used in a variety of industries and applications, such as industrial automation, medical, transportation, point-of-sale, etc.. Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages.
Our latest news
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2/03/2021
congatec doubles performance with AMD Ryzen™ Embedded V2000 processor
More power for low power 24/7 systems.
2/03/2021
congatec SMARC 2.1 modules with NXP i.MX 8M Plus processor
Low power flagship for embedded vision and AI.
2/03/2021
congatec starter set for COM-HPC™ with 11th Gen Intel® Core™ processors
Getting in the fast lane to Gen4.
18/02/2021
congatec to solve ruggedization challenges of edge server and client designs
Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC.
10/11/2020
Hot stuff for extreme temperatures
New congatec modules with 11th Gen Intel Core processors for outdoor and in-vehicle applications.
10/11/2020
Real-time operation over broadband
congatec introduces new platforms for tactile internet applications.
10/11/2020
Important milestone for the COM-HPC integration
congatec introduces new ecosystem for COM-HPC.
10/11/2020
Embedded at the edge and in the fog
congatec extends its solution platform offering to rugged fog computing market.
10/11/2020
Massively more power on much smaller footprint
congatec premiers AMD Ryzen™ Embedded V2000 processor on COM Express Compact.
New products
congatec
COM Express Type 7 come in a headless design and are available with ten different server processors: From the 16 Core Intel® Xeon® processor D1577 to the Intel® Pentium® processor D1519 for the industrial temperature range (-40 °C to +85 °C). In terms of memory, they offer up to 48 gigabytes of fast 2400DDR4 memory with or without error correction code (ECC) depending on customers’ requirements.
Category: Safety
Products
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conga-MIPI/Skit-ARM
- Application-ready embedded vision kit to enable video analytics at the industrial IOT Edge
- Using this kit enables instant deployable industrial-grade plug and play camera applications
- Based on 3.5“ Carrier Board conga-SMC1, SMARC 2.0 conga-SMX8 and Basler 13MP MIPI camera
- Using this kit enables instant deployable industrial-grade plug and play camera applications
- Based on 3.5“ Carrier Board conga-SMC1, SMARC 2.0 conga-SMX8 and Basler 13MP MIPI camera
conga-X7EVAL
- Evaluation Carrier Board for COM Express Type 7 modules
- Schematics available
- Schematics available
conga-MEVAL
- COM Express Type 10
- Evaluation Carrier Board
- Schematics available
- Reference Carrier Board
- Evaluation Carrier Board
- Schematics available
- Reference Carrier Board
conga-STX7/carrier
- Intel® 5x5 mini-STX form factor (5.5“ x 5.8“)
- 4 x 10 GbE LAN (SFP+ modules)
- 3 x 1 GbE LAN
- 3 x M.2 sockets (2x M-Key 2280, 1x B-Key 3042)
- Onboard BMC ASPEED AST2500
- General purpose B2B connector for add-on cards (PCIe x16)
- 4 x 10 GbE LAN (SFP+ modules)
- 3 x 1 GbE LAN
- 3 x M.2 sockets (2x M-Key 2280, 1x B-Key 3042)
- Onboard BMC ASPEED AST2500
- General purpose B2B connector for add-on cards (PCIe x16)
conga-SKIT/APL
- SMARC 2.0 Starter Kit
- All accessories out of the box
- Immediate evaluation for SMARC 2.0
- All accessories out of the box
- Immediate evaluation for SMARC 2.0
conga-MCB|Qseven
- Mini Carrier Board for Qseven
- Complete Set of IOs
- Size 95x140 mm²
- Complete Set of IOs
- Size 95x140 mm²
conga-SEVAL
- SMARC 2.0 Evaluation Carrier Board
- Reference Carrier Board
- Reference Carrier Board
conga-SKIT/ARM i.MX8
- Starter Kit for SMARC 2.0 Development
- All accessories out of the box
- Immediate evaluation for SMARC 2.0
- All accessories out of the box
- Immediate evaluation for SMARC 2.0
conga-QKIT/ARM
- Qseven Starter Kit for ARM
- All accessories out of the box
- Immediate evaluation for Qseven
- All accessories out of the box
- Immediate evaluation for Qseven
conga-QKIT/x86
- Qseven Starter Kit
- All accessories out of the box
- Immediate evaluation for Qseven
- All accessories out of the box
- Immediate evaluation for Qseven
conga-MCB/Qseven-ARM
- Mini Carrier Board for Qseven ARM
- Complete Set of IOs
- Dimension: 145 x 95mm
- Complete Set of IOs
- Dimension: 145 x 95mm
conga-QEVAL/Qseven 2.0
- Qseven Evaluation Carrier Board for Qseven 2.0
- Reference Carrier Board
- Reference Carrier Board
conga-PA7
Pico-ITX SBC based on Intel® Atom® x6000E, Intel®
Pico-ITX SBC based on Intel® Atom® x6000E, Intel®
-High performance Intel® UHD Graphics (Gen11)
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing enable improved Realtime Capability
-Up to 4.267 MT/s Memory Support with Inband ECC
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing enable improved Realtime Capability
-Up to 4.267 MT/s Memory Support with Inband ECC
conga-SA7
SMARC 2.1 module based on Intel® Atom® x6000E and
SMARC 2.1 module based on Intel® Atom® x6000E and
-High performance Intel® UHD Graphics (Gen11)
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s Memory Support with Inband ECC
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s Memory Support with Inband ECC
conga-QA7
Qseven module based on Intel® Atom® x6000E, Intel®
Qseven module based on Intel® Atom® x6000E, Intel®
-High performance Intel® UHD Graphics (Gen11)
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s onboard Memory Support with Inband ECC
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s onboard Memory Support with Inband ECC
conga-MA7
COM Express® Mini Type 10 module based on Intel® A
COM Express® Mini Type 10 module based on Intel® A
-High performance Intel® UHD Graphics (Gen11)
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s onboard Memory Support with Inband ECC
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 4.267 MT/s onboard Memory Support with Inband ECC
conga-TCA7
COM Express Type 6 Compact based on Intel® Atom® x
COM Express Type 6 Compact based on Intel® Atom® x
-High performance Intel® UHD Graphics (Gen11)
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 3.200 MT/s DDR4 SODIMM Memory Support with Inband ECC
-Options for Industrial Temperature Range -40°C to 85°C
-Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
-Up to 3.200 MT/s DDR4 SODIMM Memory Support with Inband ECC
conga-TC570
COM Express Type 6 Compact module based on 11th Ge
COM Express Type 6 Compact module based on 11th Ge
-COM Express Type 6 Compact
-PCI Express Gen 4 ?
-Embedded/Industrial use condition
-Extended temperature options available
-Integrated high performance Xe (Gen 12) graphics with 96 EU
-AI/DL Instruction Sets including VNNI
-PCI Express Gen 4 ?
-Embedded/Industrial use condition
-Extended temperature options available
-Integrated high performance Xe (Gen 12) graphics with 96 EU
-AI/DL Instruction Sets including VNNI
conga-HPC/cTLU
COM-HPC high performance module based on 11th Gen
COM-HPC high performance module based on 11th Gen
-COM HPC Client Size A
-PCI Express Gen 4 ?
-Embedded/Industrial use condition
-Extended temperature options available
-Integrated high performance Xe (Gen 12) graphics with 96 EU
-AI/DL Instruction Sets including VNNI
-PCI Express Gen 4 ?
-Embedded/Industrial use condition
-Extended temperature options available
-Integrated high performance Xe (Gen 12) graphics with 96 EU
-AI/DL Instruction Sets including VNNI
conga-TCV2
COM Express Type 6 Compact module based on AMD Emb
COM Express Type 6 Compact module based on AMD Emb
-COM Express Compact Type 6
-Next gen 7nm SOC
-High performance Zen 2 CPU & VEGA 7 GPU
-Huge scalability with TDP Range from 10-54W
-Up to 64GByte dual channel DDR4 3200MT/s memory ECC & Non ECC
-AMD Secure Processor with Secure Boot (SME)
-Next gen 7nm SOC
-High performance Zen 2 CPU & VEGA 7 GPU
-Huge scalability with TDP Range from 10-54W
-Up to 64GByte dual channel DDR4 3200MT/s memory ECC & Non ECC
-AMD Secure Processor with Secure Boot (SME)
conga-TEVAL/COMe 2.1
Evaluation Carrier Board for COM Express® Type 6 M
Evaluation Carrier Board for COM Express® Type 6 M
-COM Express Type 6
-Evaluation Carrier Board
-Schematics available
-Reference Carrier Board
-Evaluation Carrier Board
-Schematics available
-Reference Carrier Board
conga-TEVAL/COMe 3.0
Evaluation Carrier Board for COM Express® Type 6 M
Evaluation Carrier Board for COM Express® Type 6 M
-COM Express Type 6 Rev. 3.0 Evaluation Carrier Board
-Reference Carrier Board
-Reference Carrier Board
conga-SMC1/SMARC-x86
Compact sized Carrier Board for x86 based SMARC 2.
Compact sized Carrier Board for x86 based SMARC 2.
-Compact sized SMARC 2.0 Carrier Board
-Support of x86 based SMARC 2.0 Modules
-Ready-to-use Carrier Board
-Platform for rapid customizing
-Support of fast implementation and improved Time-To-Market
-Support of x86 based SMARC 2.0 Modules
-Ready-to-use Carrier Board
-Platform for rapid customizing
-Support of fast implementation and improved Time-To-Market
conga-TR4
COM Express® Type 6 module based on AMD Ryzen Embe
COM Express® Type 6 module based on AMD Ryzen Embe
-AMD’s Next Gen V1000 processor Series
-“Zen” core architecture with up to 4 cores-Improved graphic performance with “Vega” GPU
-Up to 32GByte dual channel DDR4 3200MT/s memory
-TDP scalable down to 12W -up to 4 x 4K DP / eDP
-“Zen” core architecture with up to 4 cores-Improved graphic performance with “Vega” GPU
-Up to 32GByte dual channel DDR4 3200MT/s memory
-TDP scalable down to 12W -up to 4 x 4K DP / eDP
conga-B7E3
COM Express Basic Type 7 Server Class module based
COM Express Basic Type 7 Server Class module based
-COM Express Type 7
-AMD EPYC™ Embedded 3000 Series up to 16 Cores, 32MB Cache and 30..100W TDP
-4x 10 Gigabit Ethernet KR Interface-Up to 32 PCI Express generation 3 lanes
-Industrial grade variant-Optional Onbard NVMe SSD up to 1 TB capacity
-AMD EPYC™ Embedded 3000 Series up to 16 Cores, 32MB Cache and 30..100W TDP
-4x 10 Gigabit Ethernet KR Interface-Up to 32 PCI Express generation 3 lanes
-Industrial grade variant-Optional Onbard NVMe SSD up to 1 TB capacity
conga-B7AC
COM Express Type 7 Basic module based on the lates
COM Express Type 7 Basic module based on the lates
-COM Express Type 7
-Up to Intel® AtomTM C3958 with 16 Cores and 16MB Cache
-4x 10 Gigabit Ethernet KR Interface-Up to 96 Gbyte DDR4 memory
-20 PCI Express lanes
-Industrial grade variants
-Server Class Features (RAS, QoS, Virtualization, Security, Managebility)
-Up to Intel® AtomTM C3958 with 16 Cores and 16MB Cache
-4x 10 Gigabit Ethernet KR Interface-Up to 96 Gbyte DDR4 memory
-20 PCI Express lanes
-Industrial grade variants
-Server Class Features (RAS, QoS, Virtualization, Security, Managebility)
conga-SMX8-Mini
SMARC 2.0 module based on NXP i.MX8M Mini processo
SMARC 2.0 module based on NXP i.MX8M Mini processo
-SMARC 2.0 Module based on NXP i.MX 8M Mini
-Scalable ARM Performance with up to 4x 1.8GHzCortex
-A53 and 1x Cortex-M4F
-Highly improved power efficiency and performanceby 14LPC FinFETprocess technology
-3D Graphics with Full HD resolution-MIPI CSI-2 camera interface-Extended longevity up to 15 years
-Scalable ARM Performance with up to 4x 1.8GHzCortex
-A53 and 1x Cortex-M4F
-Highly improved power efficiency and performanceby 14LPC FinFETprocess technology
-3D Graphics with Full HD resolution-MIPI CSI-2 camera interface-Extended longevity up to 15 years
conga-SMX8X
SMARC 2.0 module based on Ultra Low Power NXP i.MX
SMARC 2.0 module based on Ultra Low Power NXP i.MX
-NXP i.MX8-X ARM Cortex-A35 and Cortex-M4F
-Ultra Low Power 2-5W-Industrial grade, improved Reliability and Virtualization
-3D Graphics up to two independent HD displays-MIPI CSI
-2 camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
-Ultra Low Power 2-5W-Industrial grade, improved Reliability and Virtualization
-3D Graphics up to two independent HD displays-MIPI CSI
-2 camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
conga-SMX8
SMARC 2.0 module based on NXP i.MX8 ARM Cortex-A72
SMARC 2.0 module based on NXP i.MX8 ARM Cortex-A72
-NXP i.MX8 ARM Cortex-A72, Cortex-A53 and Cortex-M4F
-Advanced Graphics, Performance and Virtualization-3D Graphics up to 4K with HDMI 2.0a & LVDS
-Vision Extensions, MIPI CSI
-2 dual camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
-Advanced Graphics, Performance and Virtualization-3D Graphics up to 4K with HDMI 2.0a & LVDS
-Vision Extensions, MIPI CSI
-2 dual camera interface-Extended longevity up to 15 years-Temperature range up to -40°C .. +85°C
conga-SA5
SMARC 2.0 module based on 5th Generation Intel® At
SMARC 2.0 module based on 5th Generation Intel® At
-Low Power Intel® AtomTM, Intel® Celeron® and Intel® Pentium® processor
-High performance Intel® Gen. 9 graphics
-Industrial Temperature-Time Coordinated Computing -Enhanced Security Execution
-High performance Intel® Gen. 9 graphics
-Industrial Temperature-Time Coordinated Computing -Enhanced Security Execution
conga-IC370
Highest Performance Thin-Mini-ITX board based on 8
Highest Performance Thin-Mini-ITX board based on 8
-Highest Performance Thin Mini-ITX board
-8th Generation Intel® Core™ MobileLow Power U-Processors with up to 4 cores
-Gen 9 Intel Graphics; up to 24EU-Options for 2nd internal display-Wide Range Power Input 12-24 Volt-congatec embedded Board Controller Features
-8th Generation Intel® Core™ MobileLow Power U-Processors with up to 4 cores
-Gen 9 Intel Graphics; up to 24EU-Options for 2nd internal display-Wide Range Power Input 12-24 Volt-congatec embedded Board Controller Features
conga-IT6
COM Express Type 6 Carrier Board on Mini-ITX form
- COM Express Type 6 Carrier Board
- Mini-ITX form factor
COM Express Type 6 Carrier Board on Mini-ITX form
- COM Express Type 6 Carrier Board
- Mini-ITX form factor
conga-JC370
Highest Performance 3.5'' Single Board Computer ba
Highest Performance 3.5'' Single Board Computer ba
-Highest Performance 3.5’’ Single Board Computer-8thGeneration Intel® Core™ SOC processors with up to 4 cores-Intel® UHD
-Graphics 610/620,up to 24 Execution Units
-Up to 64 GByte dual channel DDR4 2400 MT/s
-Multiple Expansion card sockets
-Flexible internal and external Video interfaces
-Wide Range Power Input 12 –24V
-congatec embedded Board Controller Features
-Graphics 610/620,up to 24 Execution Units
-Up to 64 GByte dual channel DDR4 2400 MT/s
-Multiple Expansion card sockets
-Flexible internal and external Video interfaces
-Wide Range Power Input 12 –24V
-congatec embedded Board Controller Features
conga-TC370
COM Express Type 6 Compact module based on 8th Gen
- 8th Generation Intel® Core™ SOC processor
up to 4 cores
- Configuration of display mode by software (LVDS/eDP)
- Low power consumption (TDP 15W, cTDP 10W)
- Up to 64 GByte dual channel DDR4 2400 MT/s
- Optional eMMC 5.1 on board mass storage
- Trusted Platform Module (TPM 2.0)
COM Express Type 6 Compact module based on 8th Gen
- 8th Generation Intel® Core™ SOC processor
up to 4 cores
- Configuration of display mode by software (LVDS/eDP)
- Low power consumption (TDP 15W, cTDP 10W)
- Up to 64 GByte dual channel DDR4 2400 MT/s
- Optional eMMC 5.1 on board mass storage
- Trusted Platform Module (TPM 2.0)
conga-PA3
High Performance PICO-ITX
High Performance PICO-ITX
- 3rd Gen. Intel® Atom™ / Celeron® processors
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C optional
- Size 72x100 mm
- Pico-ITX Single Board Computer
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C optional
- Size 72x100 mm
- Pico-ITX Single Board Computer
conga-TCA3
Low Power Consumption COM Express Type6 module
Low Power Consumption COM Express Type6 module
- 3rd Gen. Intel® Atom™ processor up to 4 cores
- COM Express Compact Type 6
- Temperature range up to -40°C .. +85°C
- COM Express Compact Type 6
- Temperature range up to -40°C .. +85°C
conga-TC97
Fast and Compact COM Express Type6 module
Fast and Compact COM Express Type6 module
- 5th Gen. Intel® Core™ i7 dual core processor
- up to Intel® HD Graphics 6000
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension
for improved floating point computing
- COM Express Compact Type 6
- up to Intel® HD Graphics 6000
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension
for improved floating point computing
- COM Express Compact Type 6
conga-MA3
Powerful and Small
Powerful and Small
- 3rd Gen. Intel® Atom™ processor family
- COM Express Mini Type 10
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
- COM Express Mini Type 10
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
conga-MA3E
COM Express Mini Typ10 module with ECC memory
COM Express Mini Typ10 module with ECC memory
- 3rd Gen. Intel® Atom™ processor family
- COM Express Mini Type 10
- ECC protected memory up to 8 GByte
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
- COM Express Mini Type 10
- ECC protected memory up to 8 GByte
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
conga-QA3
Qseven - High Performance
Qseven - High Performance
- 3rd Gen. Intel® Atom™ processor family
- Low power, up to 4 cores
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
- Low power, up to 4 cores
- High resolution Intel® Gen. 7 graphics
- Temperature range up to -40°C .. +85°C
conga-TC170
COM Express Typ6
COM Express Typ6
- 6th Generation Intel® Core™ ULV processors
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Up to 32GB dual channel DDR4 memory
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Up to 32GB dual channel DDR4 memory
conga-TS170
COM Express Basic
COM Express Basic
- 6th Generation Intel® Core™ processor
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- ECC memory support for Xeon and i3 version
- Up to 32GByte dual channel DDR4 memory
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- ECC memory support for Xeon and i3 version
- Up to 32GByte dual channel DDR4 memory
conga-QA5
Qseven
Qseven
- Intel® Atom™ Quad Core on Qseven
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
- Fast I/Os SATA3, USB 3.0 and PCIe 2.0
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
- Fast I/Os SATA3, USB 3.0 and PCIe 2.0
conga-QA3E
Qseven
Qseven
-Low Power 5 to 10 Watt
-Intel® HD Graphics Generation 7
-ECC memory support
-3rd Generation Intel® Atom™ / Celeron®
-Intel® HD Graphics Generation 7
-ECC memory support
-3rd Generation Intel® Atom™ / Celeron®
conga-TS175
COM Express Type6
COM Express Type6
- 7th Generation Intel® Core™ processor
-Intel® Xeon® processors for data center applications
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- ECC memory support
- Up to 32 GByte dual channel DDR4 memory
-Intel® Xeon® processors for data center applications
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- ECC memory support
- Up to 32 GByte dual channel DDR4 memory
conga-TC175
COM Express Type6
COM Express Type6
- 7th Generation Intel® Core™ SOC processor
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- Low power consumption (TDP 15W, cTDP 7.5W)
- Up to 32 GByte dual channel DDR4 memory
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- Low power consumption (TDP 15W, cTDP 7.5W)
- Up to 32 GByte dual channel DDR4 memory
conga-TCA5
COM Express Type6
COM Express Type6
- Intel® Pentium® Quad Core on COM Express
- Enhanced Security Execution
- up to 3 independent Ultra HD displays
- Enhanced Security Execution
- up to 3 independent Ultra HD displays
conga-B7XD
COM Express Type7
COM Express Type7
- Up to Intel® Xeon® D 1577 with 16 Cores
- 2x 10 Gigabit Ethernet KR Interface
- 32x PCI Express lanes
- up to 16 processor cores
- up to 24MByte Cache with Intel Cache Allocation Technology
- industrial grade variants
- 2x 10 Gigabit Ethernet KR Interface
- 32x PCI Express lanes
- up to 16 processor cores
- up to 24MByte Cache with Intel Cache Allocation Technology
- industrial grade variants
conga-MA5
COM Express Type10
COM Express Type10
- 5th Gen. Intel® Atom™ processor family
- COM Express Mini Type 10 module
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
- COM Express Mini Type 10 module
- Intel 9th generation (Gen 9) LP graphics
- Up to 4k resolution (4096x2160@60Hz)
- 4K Codec Decode & Encode for HEVC, H.264, VP8
conga-IC175
Thin Mini-ITX Single Board Computer
Thin Mini-ITX Single Board Computer
- Highest Performance Thin Mini-ITX board
- 7th Generation Intel® CoreTM Mobile SOC U-Processors
- Improved Graphics Performance with HD600 Series
- Ready for Intel® Optane™ memory technology on M.2
- Wide Range Power Input 12-24 Volt
- 7th Generation Intel® CoreTM Mobile SOC U-Processors
- Improved Graphics Performance with HD600 Series
- Ready for Intel® Optane™ memory technology on M.2
- Wide Range Power Input 12-24 Volt
conga-IC170
Thin Mini-ITX Single Board Computer
Thin Mini-ITX Single Board Computer
- Highest Performance Thin Mini-ITX board
- 6th Generation Intel® CoreTM Mobile SOC U-Processors
- Improved Graphics Performance with HD500 Series
- Wide Range Power Input 12-24 Volt
- congatec embedded Board Controller Features
- 6th Generation Intel® CoreTM Mobile SOC U-Processors
- Improved Graphics Performance with HD500 Series
- Wide Range Power Input 12-24 Volt
- congatec embedded Board Controller Features
conga-IA5
Mini ITX Single Board Computer
Mini ITX Single Board Computer
- Intel® 5th Gen. Atom™, Celeron® and Pentium® Processors
- Low Power CPUs 6 to 12 Watt TDP
- Enhanced Intel® HD Graphics Generation 9
- Long life components for 24/7 embedded use
- Extended Temperature variants
- Low Power CPUs 6 to 12 Watt TDP
- Enhanced Intel® HD Graphics Generation 9
- Long life components for 24/7 embedded use
- Extended Temperature variants
conga-PA5
Pico ITX
Pico ITX
- Intel® 5th Gen. Atom™, Celeron® and Pentium® Processors
- Compact design for size-sensitive devices in harsh environments
- Low Power CPUs 6 to 12 Watt TDP
- Enhanced Intel HD Graphics Generation 9
- Long life components for 24/7 embedded use
- Extended Temperature variants
- Compact design for size-sensitive devices in harsh environments
- Low Power CPUs 6 to 12 Watt TDP
- Enhanced Intel HD Graphics Generation 9
- Long life components for 24/7 embedded use
- Extended Temperature variants
conga-TS370
COM Express Type 6 Basic module based on 8th Gener
- 8th Generation Intel® Core™ processor with up to 6 Cores
- Intel® Xeon® processors for data center applications
- Support for USB 3.1 Gen2 with 10Gbit/s
- Intel® Optane™ memory support
- ECC memory support
- Up to 64 GByte dual channel DDR4 memory
COM Express Type 6 Basic module based on 8th Gener
- 8th Generation Intel® Core™ processor with up to 6 Cores
- Intel® Xeon® processors for data center applications
- Support for USB 3.1 Gen2 with 10Gbit/s
- Intel® Optane™ memory support
- ECC memory support
- Up to 64 GByte dual channel DDR4 memory
conga-SMC1/SMARC-ARM
- Compact sized SMARC 2.0 Carrier Board
- Ready-to-use Carrier Board
- Platform for rapid
- Support of fast implementation and improved Time-To-Market
- Ready-to-use Carrier Board
- Platform for rapid
- Support of fast implementation and improved Time-To-Market
Downloads
congatec Product Guide 2021
congatec Product Guide
Video
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The SMARC conga-SA7
COM-HPS Starter Set
Embedded Computer-on-Modules
Interview: Intel Atom® x6000E processor
Interview: 11th Gen Intel® Core™ processors
conga-TC570
conga-PA5
Embedded World 2020
conga-TC370 - COM Express Compact Module
World-leading platforms for embedded system
8th Gen Intel® Core™ U-Series processors
congatec's first COM Express Type 7 module
The 3.5 inch single board computer (SBC) business
Retail Deep Learning Application
Embedded world 2019
Photo
Multimedia
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